PCB/RF Design Engineer

About the role

QuantWare is seeking an RF/PCB Design Engineer to drive the physical realization of next-generation 3D quantum hardware architecture. You will own the design of critical microwave components, create high-density cryo-compatible PCB layouts, and build novel packaging solutions for large-scale QPUs. This role involves working at the intersection of hardware and software to streamline development through automated workflows.

Responsibilities

• Design critical electromechanical components that form the chief interface of QPUs and TWPAs.
• Utilize CAD to design PCBs, silicon chip layout, and PCB-to-chip interconnect within the vertical VIO architecture.
• Solve complex challenges related to insertion loss, impedance matching, and cross-talk at the PCB and package levels.
• Design for and validate performance across the full temperature range from room temperature to millikelvin.
• Account for thermal cycling, differential contraction, and material behavior at cryogenic temperatures.
• Run cooldown and characterization tests in dilution refrigerators.

Required skills

• PCB design
• RF/Microwave Engineering
• KiCAD
• Altium Designer
• Cadence
• Cryogenic hardware
• Schematic development
• Signal integrity
• Impedance analysis

Nice to have

• LTCC
• HTCC
• High-density interconnects
• 3D packaging
• Superconducting technologies
• VNA
• RF testing

Qualifications

• BSc in Electrical Engineering
• MSc in Electrical Engineering

Benefits

• Competitive salary
• 8% holiday allowance
• Pension plan
• Learning and development budget

About the Company

QuantWare is building the world’s most powerful quantum processors using unique VIO technology to unlock the path to MegaQubit quantum processors. The company is focused on hyper-scale quantum computers and operates in a high-performing, ambitious environment.