Senior Integrated Photonics Packaging Engineer

About the role

As a Senior Integrated Photonics Packaging Engineer, you will lead the research, development, and validation of novel electrical and optical packaging concepts for photonic integrated circuits. You will own the end-to-end development process, from first-principles design through prototyping and benchtop characterization, to ensure the performance and scalability of photonic processing systems. This role requires bridging optical, electrical, and thermal domains to solve complex engineering challenges in a fast-paced R&D environment.

Responsibilities

• Conceive, build, and experimentally validate novel packaging prototypes and assembly methods for the co-integration of PICs with light sources, photodetectors, and high-speed analog electronics.
• Lead packaging R&D workstreams from concept definition and experiment design to hands-on benchtop testing and documented knowledge transfer.
• Define packaging requirements and solve complex optical coupling, RF/microwave signal integrity, and thermal management challenges from a first-principles understanding.
• Design, build, and measure advanced optical coupling schemes such as edge coupling, grating coupling, lensed fiber, and micro-lens arrays.
• Partner closely with PIC designers, systems engineers, and electronics teams to ensure packaging architectures are co-designed with device- and system-level constraints in mind.
• Document process recipes, assembly procedures, design rules, and tolerance budgets to enable manufacturability assessments, repeatability, and IP generation.
• Coordinate with external partners and suppliers for specialized materials or fabrication capabilities as the technical lead.
• Mentor junior engineers and contribute to shaping the team’s overall packaging R&D roadmap.

Required skills

• Photonic Packaging
• Optoelectronic Integration
• Optical Coupling
• Prototyping
• Characterization
• RF signal integrity
• Thermal management
• Flip-chip bonding
• Wire bonding
• Die attach
• Hermetic encapsulation
• Optical characterization
• Electrical characterization

Nice to have

• Zemax
• Lumerical
• German language

Qualifications

• Master’s degree in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field
• Ph.D. in Photonics, Optoelectronics, Electrical Engineering, Physics, or a related field

About the Company

Q.ANT is building photonic processing systems that compute with light, delivering a scalable and energy-efficient alternative to transistor-based architectures for next-generation AI and high-performance computing.