Senior HW Engineer – Signal and Power Integrity

About the role

This role owns the signal and power integrity modelling, stackups, materials, and design rules for high-speed hardware systems. You will be responsible for pre-layout channel studies and post-layout analysis to ensure system performance and prevent respin cycles. The position involves significant lab work to correlate simulation results with physical hardware measurements.

Responsibilities

• Run pre-layout channel studies to set routing topologies, stackups, materials and design constraints for high-speed interfaces.
• Carry out post-layout SI analysis of critical channels: insertion and return loss, crosstalk, and eye and COM analysis using IBIS-AMI models.
• Design and optimise vias, breakouts, connector launches, and the transitions into optical engines and co-packaged components.
• Set PDN impedance targets, design decoupling strategies, and run DC drop and AC PDN analysis for high-current ASIC and FPGA rails.
• Support package, interposer and board co-simulation with the ASIC team to keep channel and power integrity sound end to end.
• Correlate simulation with lab measurements using TDRs, VNAs and oscilloscopes, and feed the results back into models and design rules.
• Evaluate and characterise PCB materials, connectors and cable assemblies with suppliers and fabricators.
• Build up our SI/PI methodology, model libraries and design guidelines so they can be reused across projects.

Required skills

• SI/PI
• PCB design
• Ansys HFSS
• SIwave
• Keysight ADS
• Cadence Sigrity
• Cadence Clarity
• Transmission line theory
• S-parameters
• Crosstalk
• IBIS
• IBIS-AMI
• PDN design
• DC IR drop analysis

Nice to have

• VNA
• TDR
• Oscilloscopes
• 56G/112G PAM4
• PCIe Gen5/6
• Package co-simulation
• Interposer co-simulation
• Python
• MATLAB

Qualifications

• Degree in electronic engineering, physics or a related discipline

About the Company

Lumai is an optical compute company building the next generation of AI infrastructure. Spun out of the University of Oxford in 2021, the company develops 3D optical technology that performs matrix multiplications using light to improve energy efficiency in AI systems.